Career Opportunities

If you are interested in being a part of the team at WiSpry, we would like to hear from you.

WiSpry is an international engineering focused company with a broad system perspective. We design and build RF components that work in a system and supply chain context. As well as having world class supply chain partners, and together with our parent company AAC Technologies, we have unprecedented access to key decision makers at key OEM customers.

At WiSpry, we encourage you to be active in the international scientific community, participate in conferences and publish papers.

Working at WiSpry gives you the opportunity to combine an exciting engineering career while living in incredible communities that offer outstanding recreational activities like great hiking and biking trails, arts and cultural events in a family-friendly and safe environment.

Surf or bike before work or bike to work?

Our Orange County location features a diverse industrial base with many of the world’s leading companies in automotive, aerospace, biotech, medical, computer animation and games/animation, finance and fashion/lifestyle brand companies, to name a few. The region also offers many opportunities outside the technology industry.

More information about the Orange County region can be found here.

We have an on-going commitment to encourage and support our employees’ efforts to continue their education for career advancement through hands-on training, seminars and webinars.
We encourage publication of White Papers and reward Patent filings and inventions. Working at WiSpry where cutting-edge technology is being developed by the best minds in the Industry is in itself an invaluable opportunity.

WiSpry ‘s strength is our Company Culture that comes from our amazing diverse workforce where we’re excited to learn about our cultural differences, traditions and where mutual respect is fostered on a daily basis.
In addition to the reward of being part of a great team, WiSpry offers the following company benefits:

  • Health Insurance
  • Dental Insurance
  • Vision Insurance
  • Life Insurance
  • Short Term Disability
  • 401k
  • FSAs for both child care and healthcare
  • Paid vacation
  • Paid Sick Leave
  • Personal Family Leave
  • Reward Programs
  • Employee Events

Job Openings

Principal MEMS Development Engineer

 

SUMMARY:

The Principal MEMS  Development Engineer will define and lead key technology development activities as they relate to tunable RF MEMS, including capacitors and switches. The technology development will include the wafer fabrication, and the packaging and assembly, which are intended to produce integrated tunable systems (filters, radio front ends, PAs) when integrated with WiSpry’s RF MEMS. The Principal MEMS Development Engineer will need to have a fundamental understanding of MEMS and CMOS design, and the Materials Science required to produce durable, high performance RF MEMS capacitors and switches. Process technology, performance and endurance testing methods, and advanced packaging experience are also a requirement. In addition, the candidate should have an excellent understanding of material systems including dielectrics and metals.

The Principle MEMS Development Engineer will fill a cross-functional role by contributing to product qualification and release to production for new technology. This position will work with Wispry’s foundry partners and suppliers to achieve key technical milestones. As part of the cross-functional development, the Principal MEMS Development Engineer will be part of a collaborative engineering team working with MEMS engineers, RF/CMOS Engineering and Operations (Fabrication, Assembly, and Test).

ESSENTIAL RESPONSIBILITIES:

    • Define requirements, and develop integration proposal and plan for RF MEMS switch and capacitor technology
  • Work with Foundry, MEMS engineers, RF engineers to develop and release to production WiSpry’ S RF MEMS Products.

 

  • Work with MEMS Engineering and Operations teams on Continuous Improvement efforts related to Yield and MEMS Reliability.
  • Definition and execution of RF MEMS new product Technology Development proposals and plans.
  • Work with Foundries (FEOL and BEOL) to execute MEMS Technology Development.
  • Work with MEMS Engineering and Operations teams to define test and characterization plans and summarize characterization results.
  • Lead Technology Development Reviews to outcome of development efforts.
  • Work with Operations, Quality, and Reliability on the effective and timely qualification and release to production of new technology. 

REQUIRED SKILLS:

  • Experience with MEMS design and layout tools such as Coventor, SEMulator, Ansys, Matlab, Cadence, and Mentor Graphics.
  • Proficiency with statistical analysis and design of experiments using tools such as SAS, SAS JMP, Excel.
  • Proficiency with FMEA and 8D Problem solving methodologies.
  • Expertise with RF MEMS materials selection for performance and process integration of capacitors and switches, ideally in a CMOS foundry environment.
  • Knowledge of RF design and design tools such as HFSS, ADS, MWO preferred.
  • Knowledge of MEMS and RF MEMS test and characterization techniques using tools such as Lab View, white light interferometry, laser Doppler vibrometry, nanoindentation, AFM, oscilloscopes, power supplies, network analyzers, LCR meters.
  • Knowledge of wafer probe and package level characterization.
  • Experience applying failure analysis techniques such as Imaging Techniques (SEM, FIB, AFM, Thermal, CSAM) or surface/volume analytical techniques (Raman, FTIR, TOF-SIMS, Auger, EDS, ESCA, XPS).
  • Strong written and oral communication skills

REQUIRED EXPERIENCE:

  • M.S. in Electrical, Mechanical Engineering, Physics or Materials Science, Ph. D. is preferred
  • 15+ years MEMS Development experience, especially RF MEMS
  • Experience with integrated MEMS+CMOS development; monolithic or disintegrated solution
  • Experienced with the transfer of advanced process and design technology to product manufacturing. 

PHYSICAL DEMANDS:

The physical demands described here are representative of those that must be met by an employee to successfully perform the essential functions of this job. Reasonable accommodations may be made to enable individuals with disabilities to perform the essential functions. While performing the duties of this job, the employee is frequently required to sit; use hands to finger, handle, or feel and talk or hear. Specific vision abilities required by this job include close vision and ability to adjust focus. 

Work Environment

The work environment characteristics described here are representative of those an employee encounters while performing the essential functions of this job. Reasonable accommodations may be made to enable individuals with disabilities to perform the essential functions. The noise level in the work environment is usually quiet.

 

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Senior Packaging Engineer

 

SUMMARY:

The Sr. Packaging Engineer will support hygro-thermo-mechanical modeling and design of packaging solutions for WiSpry’s advanced RF products.  Key packaging technology areas include, but are not limited to, flip-chip, wire-bond, wafer-level chip-scale packaging (WLCSP), wafer-level fan-out (WLFO), embedded die in substrate (ECP), multi-chip module (MCM), system-in-package (SIP) and 2.5/3D integration.  Packaging technology is co-designed with the monolithic MEMS-CMOS device to provide high performance RF product applications including high performance antenna tuners, dynamic impedance matching networks, broadband programmable filters, phase shifters, RFFE and others.  The ideal candidate will apply advanced finite element analysis techniques to hygro-thermo-mechanical design for new products, strategic packaging technology and leading-edge packaging materials.

This is a crucial role in the Engineering/Development team.  The Sr. Packaging Engineer will work with engineers from analog/digital CMOS design, RF development, MEMS engineering, and Quality and Reliability (Q&R) teams on the delivery of a packaging solution for new products. In addition, this position will work closely with the Operations team to model the available technology and to characterize packaging solutions.

ESSENTIAL RESPONSIBILITIES:

  • Hygro-thermo-mechanical modeling of new and existing packaging technologies and materials.
  • Collaborate with RFIC, MEMS, RF Systems, Applications and Q&R teams on the design, characterization, and qualification of various packaging technologies for various products.
  • Support device-package co-design with MEMS, CMOS, and RF teams.
  • Contribute to and support the packaging technology roadmap.
  • Lead packaging characterization activities related to hygro-thermo-mechanical behavior, such as board-level thermal cycling and mechanical shock. Collaborate with Q&R on all aspects of physical package and failure analysis.
  • Collaborate with MEMS engineering to characterize the impact of first-level packaging on the wafer level encapsulation.
  • Support thermo-mechanical analysis (TMA), dynamic mechanical analysis (DMA), nano-indentation and other material properties characterization techniques for the purpose of package design.

REQUIRED SKILLS:

  • Expertise in a broad spectrum of packaging technologies including, but not limited to, flip-chip, wire-bond, WLCSP, WLFO, ECP, MCM, SIP and 2.5/3D integration.
  • Advanced proficiency with design/simulation tools such as ANSYS, Simulia, COMSOL, CoventorWare, AutoCad, SolidWorks, MoldFlow, etc.
  • Expertise with material characterization techniques for packaging materials including nano-indentation, DMA, TMA, and others.
  • Expertise with the design, modeling, and simulation of different packaging technologies, including an understanding of the material properties required for simulation.
  • Knowledge of the manufacturing and assembly techniques used in various packaging technologies.
  • Knowledge of statistical analysis tools such as Excel, JMP, or SAS.
  • Knowledge of statistical process control and statistics of failure (Weibull, etc.).
  • Knowledge of non-destructive packaging characterization techniques such as scanning acoustic microscopy (SAM), X-Ray, Shadow Moiré, white light interferometry, speckle interferometry, and others.
  • Knowledge of MEMS and CMOS technology.
  • Strong written and oral communication skills.

REQUIRED EXPERIENCE:

  • MS or PhD preferred in Electrical, Mechanical or Materials Engineering or Applied Physics.
  • 3+ years of experience with advanced finite element modeling of electronic packaging solutions.
  • Experience with electronic packaging technology including high frequency (RF, mmWave) electronics or MEMS is a plus.

PHYSICAL DEMANDS:

The physical demands described here are representative of those that must be met by an employee to successfully perform the essential functions of this job. Reasonable accommodations may be made to enable individuals with disabilities to perform the essential functions.

While performing the duties of this job, the employee is regularly required to sit and use hands to finger, handle, or feel.  The employee frequently is required to talk or hear.  The employee is occasionally required to stand and walk.  Specific vision abilities required by this job include close vision, color vision, and ability to adjust focus. The employee is occasionally required to travel to customer sites in the US and abroad.

WORK ENVIRONMENT: 

The work environment characteristics described here are representative of those an employee encounters while performing the essential functions of this job. Reasonable accommodations may be made to enable individuals with disabilities to perform the essential functions.  The environment is that of a typical office.  The noise level in the work environment is usually quiet.  Some travel (foreign/domestic) will be required.

Apply
  • This field is for validation purposes and should be left unchanged.
Email us for more information at: rf_mems@wispry.com