3DInCites recaps a few key presentations from the 2018 IWLPC

WiSpry presented encouraging results from their WLFO packaging demonstration at the 2018 International Wafer-Level Packaging Conference

https://www.3dincites.com/2019/01/iftle-401-fowlp-for-rf-d2w-hybrid-bonding-foplp-in-samsung-watch/